The Electronics Manufacturing and Reliability Laboratory focuses on the fabrication, packaging, and reliability of electronic devices. EMRL has expertise in the thermal analysis and reliability of GaN based wide bandgap semiconductors used in RF communications, solid state lighting, and power electronics. EMRL develops experimental techniques to measure the temperature and stress distribution in these devices down to the individual transistor level. In addition, EMRL investigates the thermophysical properties and thermal interface resistance between the active layers and substrates such as SiC, Si, and diamond in order enhance heat dissipation and lower junction temperature resistance in these devices. Coupled electro-thermal and thermomechanical modeling of these devices are used under both DC and transient timescales to understand the performance of these devices. Finally, methods to effective remove the heat from these devices using single phase and two phase cooling are under investigation. The EMRL group interacts with other universities as well as the Air Force Research Laboratory, ONR, DARPA, Raytheon, RFMD, EPC, and other groups working in this area.
In addition to wide bandgap devices, the EMRL group is also working on packaging and reliability of organic electronics and thin film solar cells. EMRL has developed expertise in the creation of ultra-barrier film technology based on vacuum deposited thin films (down to a few nanometers) for the hermetic sealing of electronics or the tailoring of electrical interfaces in organic electronics. The mass transport along with the mechanics of the films (fracture, adhesion, etc.), work function, and chemical resistance is important for the fabrication of thin film and flexible electronics for harsh environments. The EMRL group regularly collaborates with the Center for Organic Photonics and Electronics in this area of research (www.cope.gatech.edu).