Packaging Organic Electronics

Mechanical Reliability in Flexible Electronics

In this work, we are characterizing the interfacial adhesion in flexible electronics including solar cells and organic light emitting devices in order to improve mechanical reliability.  We are also investigating interface modification methods that improve the strength and durability of the interfaces.  In addition to mechanical testing, we utilize AFM, XPS, Raman Spectroscopy, and FTIR to analyze the interfaces to better understand the bonding mechanisms.

Barrier Films and Edge Sealants for Packaging Organic Electronics

In this work, we are depositing and characterizing ultrahigh performance barrier films for packaging organic electronic devices.  We are utilizing a combination of PECVD and ALD vacuum deposition methods to create single layer or multilayer barriers including all inorganic nanolaminates. Edge seals consist of desiccant filled polyisobutylene.  The overall goal is to understand transport behavior through ultrathin films and develop processing methods which can be used to create next the next generation barrier materials for flexible organic electronics.

Shelf Lifetime of Packaged Organic Electronics

In this work, we are studying the lifetime of organic electronics packaged with our barrier films.  Multilayer barrier films consisting of parylene and SiNx provide increasing barrier performance with an increasing number of bilayer pairs. This increase in barrier protection correlates well with the shelf-lifetime of organic solar cells made from pentacene/C60 donor-acceptor layers.  The goal is to better understand the impact of barrier performance on device reliability.


George Woodruff School of Mechanical Engineering